YXLON Cheetah

Microfocus/Nanofocus X-ray Inspection System for PCBA and Semiconductors

YXLON Cheetah is a performance and efficiency oriented microfocus and nanofocus X-ray inspection system for the printed circuit board assembly (PCBA) and semiconductors industries. Get the highest resolution 2D and 3D imaging results.

  • exceptional 2D/3D image quality in the shortest time
  • user-friendly operation for high-tech inspections
  • one-click solutions for advanced manipulations
  • best-in-class DR technology
  • industrial quality computed tomography (CT) upgrade option

The increasing complexity of electrical and electronic components requires YXLON to raise the inspection process to unprecedented levels of quality. As a result, the Cheetah microfocus and nanofocus X-ray inspection system was created to give you the very best image in the shortest time.

This system achieves the highest resolution X-ray images for the PCBA and semiconductors industry including:

  • printed circuit boards
  • electronic and mechanical modules
  • electromechanical components and plugs
  • semiconductor packaging and interconnects
  • sensors
  • MEMS and MOEMS

Cheetah harnesses the combined power of several YXLON innovations – FeinFocus X-ray tube technology, High Power Target technology, a finely calibrated, long-life flat-panel detector, and a manipulator with cushioned bearings. The variety of sample tables ensures that it can generate 2D and 3D images in extremely high resolution.

In addition to imaging excellence, you can look forward to simple, user-friendly controls and YXLON FGUI – FeinFocus Graphical User Interface – software, not to mention the myriad benefits of comprehensive automation. One-click solutions make manual inspections effortless, while Easy Teach-In makes it simple to program the automated procedures that guide the operator swiftly through inspections – and deliver repeatable and reliable results.

Cheetah can be upgraded for CT with the optional microCT module. This enables CT for industrial quality assurance, with in-depth 3D examination of inspection items via virtual cross sections and layers. With its user-friendly YXLON QuickScan® module, it delivers 3D images and virtual slices within a minute.


Sample Dimensions800 mm x 500 mm (31” x 19”)
System Dimensions1650 x 1400 x 1850 [mm]
Maximum Tube Power64 [W]
FeinFocus X-ray TubeFXE 160 [kV]
Time to First Image~10 [s]
µCT Scan Time~7 [s]
Maximum Geometric Magnification2000x
Casp System Dofinansowanie
Introduction of B2B class system that automates business processes taking place between CASP system and its business Partners. The project is co-financed by European Union with funds of European Regional Development Fund.
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